Ipc-9704 Pdf _top_ Here

Board depanelization (routing), manual handling, and rework.

Complete Guide to PCB Strain Gage Testing for BGA Reliability ipc-9704 pdf

While IPC/JEDEC-9704 focuses on measuring the strain applied by manufacturing processes, the related IPC/JEDEC-9702 standard focuses on characterizing the maximum strain a component's solder joints can actually survive. Key Manufacturing Processes for Testing Board depanelization (routing), manual handling, and rework